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Form 8-K · Current Report · Filed 2025-05-22

Qualcomm Announces Debt Offering and Underwriting Agreement

On May 19, 2025, Qualcomm Inc. announced the issuance of $1.5 billion in aggregate principal amount of senior unsecured notes due 2030, 2032, and 2035 through an underwriting agreement with several major banks. The notes carry interest rates of 4.500%, 4.750%, and 5.000% respectively and are subject to customary events of default as outlined in the Indenture.

Filer
Qualcomm Inc. QCOM · NASDAQ
Filed
Accession
0001104659-25-051981
CIK
0000804328
Signal
Medium impactTechnology

Items reported

Item 1.01

Entry into a Material Definitive Agreement

Financial Instrument Agreement
Item 8.01

Other Events

Convertible Notes Offering
Item 9.01

Financial Statements and Exhibits

Exhibits Furnished

Market reaction

Close before filing

$151.31

Next session

-3.9%

Since filing

-2.4%

Latest close

$147.61

What happened, not what will happen — closing prices around the filing date.

Precedent

Previous filings from QCOM reporting the same item, with the next session's move:

Exhibits (6)

About Qualcomm Inc.

Qualcomm Inc. is a global leader in the semiconductor and telecommunications equipment industries, primarily renowned for its advancements in wireless technology. The company is pivotal in developing and commercializing digital communication technologies, including 3G, 4G, and the latest 5G standards. Qualcomm's portfolio includes Snapdragon processors and modems, which are integral to the performance and connectivity features of many modern smartphones and other smart devices. With a presence in mobile, automotive, and IoT sectors, Qualcomm's innovations have a profound impact on enhancing wireless communication capabilities and powering connected experiences around the world. Additionally, Qualcomm licenses its vast array of patents to numerous device manufacturers, playing a crucial role in the evolution and deployment of new telecommunications technologies. As such, Qualcomm Inc. holds a significant position in the global technology market, driving the infrastructure for cutting-edge connectivity solutions.

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