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Form 8-K/A · Current Report · Filed 2024-10-18

Entegris, Inc. Appoints Mary Puma to Board and Audit Committee

On September 5, 2024, Entegris, Inc. announced the appointment of Mary Puma as a director, effective September 5, 2024. Additionally, on October 17, 2024, the Board appointed Ms. Puma as a member of its Audit and Finance Committee.

Filer
Entegris Inc. ENTG · NASDAQ
Filed
Accession
0001101302-24-000067
CIK
0001101302
Signal
Medium impactTechnology

Items reported

Item 5.02

Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers

Board Member Appointed

Market reaction

Close before filing

$104.16

Next session

+0.2%

Since filing

+14.3%

Latest close

$119.05

What happened, not what will happen — closing prices around the filing date.

Precedent

Previous filings from ENTG reporting the same item, with the next session's move:

About Entegris Inc.

Entegris Inc. is a specialized technology and manufacturing company that focuses on providing advanced materials and process solutions for the microelectronics industry. Its primary function is to supply critical components and materials used in the semiconductor manufacturing process, including filtration, purification, and specialty chemicals. Entegris plays a pivotal role in enabling the complex manufacturing processes of semiconductor fabrication, catering to manufacturers of integrated circuits and electronics devices. Notable sectors impacted by Entegris include computing, telecommunications, and automotive industries, where semiconductors are essential. The company's solutions are essential for ensuring the purity and integrity of materials used in chip production, which directly impacts the performance and efficiency of electronic devices. Founded in 1966 and headquartered in Billerica, Massachusetts, Entegris has established itself as a significant player in the global semiconductor supply chain, emphasizing innovation and quality in its product offerings. Its role is crucial for advancing technology nodes and meeting the high demands of modern semiconductor fabrication processes.

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