TTM Technologies, Inc.
TTM Technologies Provides 2026 Financial Guidance and Announces Refinancing Efforts
Summary
TTM Technologies, Inc. provided its financial guidance for fiscal year 2026 during its Investor Day presentation on May 27, 2026. The company reiterated its $4.0 billion revenue expectation and provided target ranges for non-GAAP operating margin (13% to 15%) and Adjusted EBITDA margin (16% to 18%). Cash flow from operations is expected to be in the range of $300-$320 million, with free cash flow expected to be slightly positive. Additionally, the company has taken steps to obtain allocated commitments for a repriced and upsized Term Loan due May 2030 in the aggregate principal amount of $400 million, and for Revolving Credit facilities that provide for available borrowings of up to $1 billion, both expected to close in June 2026. If completed, the repricing transaction is expected to reduce the company's cost of borrowing on the Term Loan facility by 50 basis points.
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About TTM Technologies, Inc.
TTM Technologies, Inc. is a leading global provider of printed circuit boards (PCBs) and related electronic manufacturing solutions. Serving a diverse range of industries, TTM Technologies focuses on delivering high-quality, technologically advanced PCBs and solutions to sectors such as aerospace, defense, medical, industrial, networking, and automotive industries. These segments demand precision, reliability, and innovation, making the company's offerings integral to their operations. TTM Technologies' capability to offer a comprehensive range of PCB products, from standard to complex multilayer printed circuit assemblies, highlights its robust manufacturing expertise and market adaptability. The company stands out with its advanced engineering services, which enable the development of custom and prototypical designs tailored to specific client needs, thereby fostering innovation and efficiency in electronics manufacturing. With facilities strategically located across North America and Asia, TTM Technologies harnesses global footprints to meet timely delivery requirements, support quick-turn prototypes, and cater to high-volume production. This operational agility underlines its critical role within the supply chain, ensuring the seamless integration of electronic solutions across various high-tech applications worldwide.
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